• Low temperature large area microelectronics
   

Low temperature large area microelectronics has attracted increasing attention for complementing the high-performance yet expensive silicon VLSIs, such as amorphous thin film transistors (a-Si TFTs) and organic thin film transistors (OTFTs). They can be built on silicon and a variety of other mechanically flexible, shock-resistant, thin, lightweight substrates, and thus expected to be ultra-low in cost even for large area integrated circuits and systems. Carrier mobility of a-Si TFTs and OTFTs is about two or three orders of magnitude lower than crystalline silicon and the resultant circuit is slow in speed. The slow speed may not fit for video and RF applications. GNS research and development team seeks ways of designs and integration to achieve high performance of TFTs such as low temperature crystalline silicon TFT integrated circuit technology and to apply it to a variety of large-area applications on thin, lightweight, flexible, and cheap substrates, such as for active matrix display and wireless sensing networks.

• MEMS, BioMEMS, and Optical MEMS technology
   

Micromachining and MEMS technology utilizes the fabrication technology of integrated circuits to produce complex structures, devices and systems on the scale of micrometers. MEMS technology has been widely used to to convert real-world signals from one form of energy to another, such as microsensors, microactuators and microsystems. The GNS scientists research, development, and commercialization of monolithically integrated MEMS technologies, devices, and systems based on the silicon integrated circuit technology, such as scalable mechanical, microfluidic, chemical and biological, thermal, electrical & magnetic, and optical systems.